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HDM2HA-19BM4RN10
载带包装 胶芯LCP料 端子SMT 半金雾锡 外壳DIP镀Ni短型带锁扣
Product General Characteristic
Product OverviewHDMI  CONN.
Component TypeReceptacle
PCB Mount TypeSMT&DIP
OrientationR/A & V/T
Physical Characteristic
Housing MaterialLCP
Contact MaterialC2680
Plating Material on Contact AreaAu
Plating Thickness on Contact AreaG/F, 15u", 30u"
Circuits19/21 pin
Pitch0.5mm
Tail LengthReference drawing dimensions
Durability10000 Cycles
Housing ColorBlack
Electrical Characteristic
Current Rating0.5A
Max. Voltage40V AC
Solder Process Characteristic
Solder Process TypeReflow Soldering
Max. Process Temperature260℃
Duration at Max. Process Temperature5s
Environment Characteristic
RoHS / Halogen Free (HF) ComplianceHF
Others
PackagingTAPE&REEL/TRAY